ENGLEWOOD, CO, March 20, 2019 (GLOBE NEWSWIRE) — Lightwave Logic, Inc. (LWLG) today announced that CEO Dr. Michael Lebby, in recognition of his global leadership position in the photonics industry, will be serving as conference co-chair of the International Photonic Integrated Circuits conference on March 26 – 27 in Brussels, Belgium. In addition, he will be participating on a discussion panel and giving an invited talk.
The theme of this year’s International PIC conference is: “Creating and Strengthening Links Between Chipmakers and Network Builders”. It brings together the complete ecosystem that provides the technology underlying all modern data services such as social media, IoT, deep learning and e-commerce. These global companies range from chipmakers and foundries to network equipment suppliers and webscale service providers. PICs, or photonics integrated circuits, are analogous to electronic integrated circuits and handle optical signals for applications such as high-speed networking for the internet.
Dr. Lebby noted, “Our intent in organizing this year’s conference was to seek global technical solutions for today’s urgent problems of speed, power, and cost and how these can be scalable for our industry. We will discuss advances on incumbent technological platforms such as Indium Phosphide and Silicon Photonics, as well as on our own proprietary plastics. It has become very clear to the industry this year that it’s all hands-on deck. We need to find significant paradigm shifts if the performance of the internet is to keep improving.”
The last few decades have seen remarkable increases in data services, but scientists have warned that technology is approaching some fundamental limits that are making continued progress more difficult. As networking speeds in the internet continue to increase, the electrical power required to pump out and move the signals goes up dramatically. Already, this power is limiting the size of datacenters. 5G and IoT is expected to demand far more processing and networking capacity.
Dr. Lebby’s talk will be entitled “Polymer PIC opportunities in applications beyond 100G”. It will start with a description of the essential role of light in modern datacenters, and the growing challenge of meeting what appears to be insatiable demand for huge amounts of data delivered immediately. The talk will explain how Lightwave Logic’s plastic polymers have the potential to address the network power consumption problem, satisfying the thirst for smaller, lighter, and faster networking equipment and allowing the continued development of new services.
Lightwave Logic is developing very high-speed photonic integrated circuits made with its own high-performance plastic material. For more information about Lightwave Logic, please visit the Company’s website at: www.lightwavelogic.com
For more information about Lightwave Logic, please visit the corporate website at: www.lightwavelogic.com. For more information about the PIC conference, please visit www.picinternational.net.
Powered by Lightwave Logic
Lightwave Logic, Inc. is a development stage company moving toward commercialization of next generation photonic devices using its high-activity and high-stability organic polymers for applications in data communications and telecommunications markets. Photonic electro-optical devices convert data from electric signals into optical signals.
The information posted in this release may contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. You can identify these statements by use of the words "may," "will," "should," "plans," "explores," "expects," "anticipates," "continue," "estimate," "project," "intend," and similar expressions. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those projected or anticipated. These risks and uncertainties include, but are not limited to, lack of available funding; general economic and business conditions; competition from third parties; intellectual property rights of third parties; regulatory constraints; changes in technology and methods of marketing; delays in completing various engineering and manufacturing programs; changes in customer order patterns; changes in product mix; success in technological advances and delivering technological innovations; shortages in components; production delays due to performance quality issues with outsourced components; those events and factors described by us in Item 1.A “Risk Factors” in our most recent Form 10-K; other risks to which our Company is subject; other factors beyond the Company’s control.